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High Purity industrial water purification plant 15m3h ultra pure water system for electroplating solutions
| Place of Origin | Shenzhen,China |
|---|---|
| Brand Name | HJW |
| Certification | ISO 14001,ISO 9001,CE,EPA |
| Minimum Order Quantity | 1set |
| Price | US$32000~US$32500 |
| Packaging Details | export standard wooden case |
| Delivery Time | 1-7working days(depand on raw materials stocking) |
| Payment Terms | L/C,D/P,T/T,Western Union |
| Supply Ability | >300sets/month |
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xProduct Details
| Flow Rate | 15m³/h(Customizable) | Water Quality | Resistivity ≥≥18.2 MΩ·cm (25°C) |
|---|---|---|---|
| Core Process | Double-pass Reverse Osmosis + EDI + Polishing Resin | Core Components | RO Membrane Modules, EDI Units |
| Operation Mode | Fully Automated | Product Features | Stable Water Quality Output, Low Operational Costs |
| Power Supply | 220V/380V/440V | Material | SUS304/UPVC |
| Highlight | Industrial Ultra Pure Water Equipment,Customizable Ultrapure Water Systems |
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Product Description
I.Overview
In the high-end electroplating industry, ultra-pure water has evolved from a “background solvent” to a critical process material. Meeting the 18.2 MΩ·cm resistivity standard is merely the baseline requirement. The ability to control specific impurities (such as Cl⁻, Na⁺, and particulates) at the parts-per-billion (ppb) level directly determines whether the plating layer can pass JESD22-A120 (chip reliability) or IPC-6012 (PCB durability) certification.
Ultra-pure water (resistivity ≥ 18.2 MΩ·cm) plays a central role in high-end electroplating processes, particularly in semiconductor packaging, PCB micro-hole copper plating, and precious metal finishing applications. Its application directly impacts plating quality, adhesion, and product yield.
II.Main process
RO Product Water → Chelating Resin Tower → Special Silica - Removing Resin→ Nuclear - Grade Mixed Bed → Vacuum Deoxygenation→ Terminal 0.1μm Filtration
III.Parameters
| Parameter | Standard Value | |||
| Resistivity | ≥18.2 MΩ·cm (25°C) | |||
| TOC | ≤1 ppb | |||
| Particles | ≤5 particles/mL (≥0.1μm) | |||
| Metal Ions | Cu/Fe/Ni < 0.1 ppb | |||
| Na⁺/K⁺ < 0.05 ppb | ||||
| Anions | Cl⁻ < 0.1 ppb | |||
| SO₄²⁻ < 0.2 ppb | ||||
| Silicate | SiO₂ < 1 ppb | |||
IV.The core functions of ultrapure water in electroplating solutions
Solvent matrix
Contaminant control
Electrochemical stability
V.Here is a guideline for you to get a proper quotation
Tell us the raw water/source of water(tap water, well water, or sea water, etc)
Provide water analysis report(TDS , conductivity, or resistivity, etc)
Required production capacity( 5m³/H, 50m³/H,or 500m³/H, etc)
What's the pure water used for( industrial,Food and Beverage,or agriculture, etc )
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