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Ultrapure Water Treatment Equipment 8000gph For Chip Industry With RO Machine + EDI Unit

Place of Origin Shenzhen,China
Brand Name HongJie
Certification ISO 14001,ISO 9001,CE,EPA
Model Number HJ-UPWCh30T
Minimum Order Quantity >=1sets
Price US$66200~US$66500
Packaging Details export standard wooden case
Delivery Time 1-7working days(depand on raw materials stocking)
Payment Terms L/C,D/P,T/T,Western Union
Supply Ability >300sets/month

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Product Details
Flow Rate 30m³/h(Customizable) Resistivity (25°C) ≥18.2 MΩ·cm (Theoretical Maximum Value Of Pure Water)
Core Process Double-pass Reverse Osmosis + EDI Core Components RO Membrane Modules, EDI Units
Operation Mode Fully Automated Product Features Stable Water Quality Output, Low Operational Costs
Electricity Supply 380V TOC ≤5 Ppb (Some Advanced Processes Require ≤1 Ppb)
Particle Count Particles Of 0.1μm ≤1 Particle/mL; Particles Of 0.05μm ≤10 Particles/mL Metal Ion Concentration Key Metals (e.g., Fe, Cu, Na, K) ≤1 Ppt
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Ultrapure Water Treatment Equipment 8000gph

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Chip Industry Ultrapure Water Treatment Equipment

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8000gph ultrapure water treatment

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Product Description

Water Treatment Equipment Suppliers 8000gph Ultrapure Water For Chip Industry With RO Machine + EDI Unit

 

I.Overview
In chip (integrated circuit) manufacturing, ultrapure water (UPW) is an indispensable key auxiliary material, often referred to as the “lifeblood of the semiconductor industry.” Its core function is to remove trace impurities (such as particles, metal ions, and organic compounds) from the surface of wafers through high-precision cleaning, dilution, or participation in process reactions, directly impacting chip yield, performance, and reliability.

 

II.Process
1.Mainstream process (applicable to 14nm and above process nodes):
Raw Water → Multi-media Filtration → Activated Carbon → Ultrafiltration (UF) → Primary RO → Secondary RO → EDI → UV (185+254 nm) → Degasification → Polishing Mixed Bed → Final Ultrafiltration → Point of Use (POU)

2.Advanced process (suitable for 7nm and below advanced processes) :
Raw water → Ultrafiltration → Double-stage RO → Continuous Electro-deionization (CEDI) → Ultraviolet (185 nm) → Membrane Degassing → Nuclear-grade Polishing Mixed Bed → 0.05μm Final Filtration → Recirculation Distribution System

 

III.Parameters

Parameter Category Chip Manufacturing Requirements
Resistivity (25°C) ≥18.2 MΩ·cm (Theoretical maximum value of pure water)
Total Organic Carbon (TOC) ≤5 ppb (Some advanced processes require ≤1 ppb)
Particle Count Particles of 0.1μm ≤1 particle/mL; Particles of 0.05μm ≤10 particles/mL
Metal Ion Concentration Key metals (e.g., Fe, Cu, Na, K) ≤1 ppt
Bacteria and Endotoxin Bacteria ≤1 CFU/100mL; Endotoxin ≤0.03 EU/mL
Dissolved Gases Dissolved oxygen ≤5 ppb; CO₂ ≤1 ppb

 

IV.Core Application Scenarios
Wafer Cleaning: Removes micro-contaminants to ensure device performance (physical rinsing, cleaning with chemical reagents)
Process Fluid Preparation: Used as a diluent or solvent (photoresist dilution, etching fluid/developing fluid preparation)
Equipment and Environment Cleaning: Prevents cross-contamination (process equipment cleaning, clean room environment maintenance)

 

V.Here is a guideline for you to get a proper quotation

Tell us the raw water/source of water(tap water, well water, or sea water, etc)
Provide water analysis report(TDS , conductivity, or resistivity, etc)
Required production capacity( 5m³/H, 50m³/H,or 500m³/H, etc)
What's the pure water used for( industrial,Food and Beverage,or agriculture, etc )